DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES
-
摘要:分别从理论计算、实验研究和失效机理的研究等几个方面综述了微电子封装结构（主要包括多层膜，焊点及引线键合等结构）的热疲劳寿命预估研究领域的进展；并对今后该领域的发展方向进行了预测．Abstract:In this paper, an overview of the development of prediction study on the thermal fatigue life of electronic packages is presented, including theore-tical and experimental aspects as well as failure mechanism analysis. A pro-phecy on the research trend in this area is suggested.
-
点击查看大图
计量
- 文章访问数:1268
- HTML全文浏览量:61
- PDF下载量:1187
- 被引次数:0
下载:
