Abstract: An analytical model was developed to investigate thecoupled effects of stress field and surface diffusion bonding during powdercompaction taking elastic contact stress distribution as theinitial condition. The stress function including the term of surface energyis introduced for describing the surface diffusion evolution and itsinfluence on stress distributions. Simultaneously, stress-induced chemicalpotential gradients may promote (or impede) diffusion bonding. Effects ofexternal load amplitude, temperature and stress distribution along the bondinterface are obtained using the present model. The results showed theeffect of initial bonded width and stress distributions in the cases ofadhesional and un-adhesional contact, respectively. Furthermore, the powderdensification process was analyzed under the initial condition of stressdistribution derived from elastic contact with adhesion.