Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047
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Citation:
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Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047
|
Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047
|
Citation:
|
Homogenization analysis of electronic packaging based on a high order layer-discrete model[J]. Chinese Journal of Theoretical and Applied Mechanics, 2005, 37(4): 428-434. DOI: 10.6052/0459-1879-2005-4-2004-047
|
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