多物理场下FCBGA焊点电迁移失效预测的数值模拟研究
MODELING OF ELECTROMIGRATION FAILURE PREDICTING FOR FCBGA SOLDER BUMP UNDER MULTI-PHYSICAL FIELD LOADS
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多物理场下FCBGA焊点电迁移失效预测的数值模拟研究 |
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| 张元祥, 梁利华, 张继成, 陈俊俊, 盛玉峰 | |
MODELING OF ELECTROMIGRATION FAILURE PREDICTING FOR FCBGA SOLDER BUMP UNDER MULTI-PHYSICAL FIELD LOADS |
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| Zhang Yuanxiang, Liang Lihua, Zhang Jicheng, Chen Junjun, Sheng Yufeng | |
| 表 163Sn37Pb和Sn3.5Ag的材料属性 | |
| Table 1Material properties of 63Sn37Pb和Sn3.5Ag | |
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